Summary
In electron beam lithography, any larger pattern than a writing field is subdivided into multiple writing fields. If writing field alignment isn't perfect, stitching errors occur. Precise stage movement and precise beam positioning are essential to minimize the errors.
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Perfect writing field alignment can avoid stitching errors. In the ideal case, the stage of the EBL system exactly equals the writing field size.
EBL system takes care of the writing field alignment. So,getting good writing field alignment is dependent on the EBL system.
How to minimize stitching errors? There are two tool factors to improve writing field alignment: (1)precise stage movement and (2)precise beam positioning
Precise stage move is essential to minimize stitching error. It can be achived by using a laser interferometer that can measure the stage position with 0.31nm resolution
Precise beam position can reduce stitching errors. A 20 bit DAC provides high beam positioning resolution.
More beam deflection leads to more stitching errors. Therefore, using a smaller field reduces the errors but the writing time increases. Choose an optimized field size for your application considering write time and stitching error. It is wise to pay attention to the flatness of sample. Otherwise, deflection scale error caused by the change in sample height will occur.
There is always going to be stitching errors because the EBL tool is not perfect. CAD solution is recommended to reduce the errors. Create a writing strategy first and design your pattern. Don't forget performing field correction with good step height of the brightness of the reference mark prior to exposure.
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Reference
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