Summary High resolution micro-uniformity map of ion beam angle is valuable to monitor beam quality control performance of an ion implanter. It provides details … [Read more...] about Ion beam angle uniformity wafer mapping using TW V-curves: Ep2
Measurement & Characterization
Ion beam angle uniformity wafer mapping using TW V-curves: Ep1
Summary Thermal Wave(TW) technique can be used to monitor the micro-uniformity beam angle performance in ion implantation. Let's start with TW measurement … [Read more...] about Ion beam angle uniformity wafer mapping using TW V-curves: Ep1
Simple and low cost test wafer for studying plasma induced wafer arcing damage
Summary Wafer arcing is a response to particular wafer surface structure geometry as well as plasma instability. Therefore, the type of wafer surface structure … [Read more...] about Simple and low cost test wafer for studying plasma induced wafer arcing damage
Electrical measurements to characterize semiconductor devices, processes, and reliability using Agilent 4156C parametric analyzers
Summary Semiconductor parameter analyzers have a wide range of electrical measurement capabilities and are used to characterize semiconductor devices, processes, … [Read more...] about Electrical measurements to characterize semiconductor devices, processes, and reliability using Agilent 4156C parametric analyzers
Electrical measurements to characterize semiconductor devices, processes, and reliability using HP 4145B parametric analyzers
Summary This comics are intended to help in understanding the electrical on-wafer measurement for semiconductor device, process and reliability characterization. … [Read more...] about Electrical measurements to characterize semiconductor devices, processes, and reliability using HP 4145B parametric analyzers