Summary
Plasma induced wafer arcing is sensitive to hardware condition as well as wafer surface structure, such as pattern layout, feature density and wafer edge roughness
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![The impact of rough edge of photoresist on plasma induced wafer arcing](https://vonoff.com/comics/case_study_of_wafer-surface-structure-sensitivity_to_plasma-induced-wafer_arcing-p1.jpg)
The effect of photoresist edge roughness on plasma induced wafer arcing
![The higher the feature density, the greater the wafer arcing risk on plasma induced wafer arcing](https://vonoff.com/comics/case_study_of_wafer-surface-structure-sensitivity_to_plasma-induced-wafer_arcing-p2.jpg)
The higher the feature density, the greater the wafer arcing risk
![The plasma induced wafer is sensitive to hardware condition as well as pattern layout](https://vonoff.com/comics/case_study_of_wafer-surface-structure-sensitivity_to_plasma-induced-wafer_arcing-p3.jpg)
The plasma induced wafer is sensitive to hardware condition as well as pattern layout
![active diode test structure sensitivity to plasma doping induced wafer arcing](https://vonoff.com/comics/wafer_test_structure_sensitivity_to_plasma_doping_induced_wafer_arcing-p4.jpg)
Active diode test structure sensitivity to plasma doping induced wafer arcing
![Too much charge accumulation on oxide causes oxide breakdown, resulting in wafer arcing](https://vonoff.com/comics/wafer_test_structure_sensitivity_to_plasma_doping_induced_wafer_arcing-p5.jpg)
Too much charge accumulation on oxide causes oxide breakdown, resulting in wafer arcing
![Antenna test structure sensitivity to plasma doping induced wafer arcing](https://vonoff.com/comics/wafer_test_structure_sensitivity_to_plasma_doping_induced_wafer_arcing-p6.jpg)
Antenna test structure sensitivity to plasma doping induced wafer arcing
![Plasma induced charging is responsible for wafer arcing and it is easily reproduced when antenna test structure charging wafer is used](https://vonoff.com/comics/wafer_test_structure_sensitivity_to_plasma_doping_induced_wafer_arcing-p7.jpg)
Plasma induced charging is responsible for wafer arcing. Therefore, good control of plasma induced surface charging can avoid wafer arcing. The wafer arcing is sensitive to the antenna test structure
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Reference
- Ma, S., et al. "Backend dielectric etch induced wafer arcing mechanism and solution." 2003 8th International Symposium Plasma- and Process-Induced Damage
- MA, S. "Plasma Induced Charging Damage: From An Semiconductor Equipment Vendor Point of View." pdfs.semanticscholar.org/presentation/a96b/ee9ad164569cfa51d2847dd83d150b000829.pdf
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