Summary Plasma induced wafer arcing is sensitive to hardware condition as well as wafer surface structure, such as pattern layout, feature density and wafer edge … [Read more...] about Wafer surface structure sensitivity to plasma doping induced arcing
micro arcs
Plasma doping process issues
Summary Some development issues related to plasma doping for mass production are plasma uniformity, particle and micro-arcs control. … [Read more...] about Plasma doping process issues